国际期刊

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Frequency-Domain Thermal Modelling of Power Modules Based on Heat Flow Spectrum Analysis

国际期刊
Mengqi Xu; Ke Ma; Quan Zhong; Marco Liserre
IEEE Transactions on Power Electronics, vol. 38, no. 2, pp. 2446-2455, Feb. 2023
Publication year: 2023

Frequency-Domain Thermal Coupling Model of Multi-Chip Power Module

国际期刊
Mengqi Xu; Ke Ma; Yuhao Qi; Xu Cai; Xinqiang Li; Aiguo Wang; Luhai Zheng
IEEE Transactions on Power Electronics, vol. 38, no. 5, pp. 6522-6532, May 2023
Publication year: 2023

Flexible and Low-Cost Emulation of Control Behaviors for Testing and Teaching of AC Microgrid

国际期刊
Jiashi Wang; Tingting Liu; Ke Ma
Energies, vol. 16, no. 4, p. 1905, Feb. 2023
Publication year: 2023

Degradation Diagnosis of Power Module Based on Frequency Characteristics in Heat Flow

国际期刊
Mengqi Xu; Ke Ma; Quan Zhong
IEEE Transactions on Power Electronics, Volume: 38, Issue: 8, August 2023
Publication year: 2023

Adaptive DC Voltage Control for Optimal Junction Temperature Redistribution under Stall Condition of Electric Machine Drive Inverter

国际期刊
Aiguo Wang; Yuhao Qi; Ke Ma
IEEE Transactions on Power Electronics, vol. 38, no. 4, pp. 4229-4234, April 2023
Publication year: 2023

Power-Electronics-Based Mission Profile Emulation and Test for Electric Machine Drive System—Concepts, Features, and Challenges

国际期刊
Ke Ma; Shihao Xia; Yuhao Qi; Xu Cai; Yubo Song; Frede Blaabjerg
IEEE Transactions on Power Electronics, vol. 37, no. 7, pp. 8526-8542, July 2022.
Publication year: 2022

Mission Profile Emulation for Flexible Number of Submodules in Modular Multilevel Converters With Nearest Level Modulation

国际期刊
Shan Jiang; Ke Ma; Xu Cai; Georgios Konstantinou
IEEE Transactions on Industrial Electronics, vol. 69, no. 12, pp. 11926-11935, Dec. 2022
Publication year: 2022

Mechanism and Cancellation of DC Current Fluctuation in MMC Excited by Circulating Current Mitigation under Nearest Level Control

国际期刊
Ke Ma; Enyi Li; Bin He; Xu Cai
IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 10, no. 6, pp. 6822-6831, Dec. 2022
Publication year: 2022

Lumped Thermal Coupling Model of Multichip Power Module Enabling Case Temperature as Reference Node

国际期刊
Mengqi Xu; Ke Ma; Xu Cai; Gongzheng Cao; Yalin Zhang
IEEE Transactions on Power Electronics, vol. 37, no. 10, pp. 11502-11506, Oct. 2022
Publication year: 2022

Full-Bandwidth Mission Profile Emulation of Electric Machine System with Voltage Reference Signal Transmission

国际期刊
Yuhao Qi; Ke Ma; Weiyu Tang
IEEE Transactions on Power Electronics, vol. 37, no. 3, pp. 3473-3483, March 2022.
Publication year: 2022
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