发表成果

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Junction Temperature Control for More Reliable Power Electronics

国际期刊
M. Andersen, K. Ma, G. Buticchi, J. Falck, F. Blaabjerg, M. Liserre
IEEE Transactions on Power Electronics, Vol. 33, No. 1, pp. 765-776, 2018.
Publication year: 2018

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

国际期刊
A. S. Bahman, K. Ma, F. Blaabjerg
IEEE Trans. on Power Electronics, Vol. 22, No. 3, pp.2518-2530, 2018.
Publication year: 2018

Wind Energy Systems

国际期刊
F. Blaabjerg, K. Ma
Proceedings of the IEEE, Vol. 105, No. 11, pp. 2116-2131, Nov 2017.
Publication year: 2017

Thermal Stress Analysis of Medium-Voltage Converters for Smart Transformers

国际期刊
M. Andersen, K. Ma, G. D. Carne, G. Buticchi, F. Blaabjerg, M. Liserre
IEEE Trans. on Power Electronics, Vol. 32, No. 6, pp. 4753-4765, 2017.
Publication year: 2017

Reliability Assessment Platform for the Power Semiconductor Devices – Study Case on 3-phase Grid-Connected Inverter Application

国际期刊
I. Vernica, K. Ma, F. Blaabjerg
Microelectronics Reliability, Vol. 76-77, pp. 31-37, 2017.
Publication year: 2017

New Approaches to Reliability Assessment: Using physics-of-failure for prediction and design in power electronics systems

国际期刊
K. Ma, H. Wang, F. Blaabjerg
IEEE Power Electronics Magazine, Vol. 3, No. 4, pp. 28-41, 2016.
Publication year: 2016

Modulation Methods for Three-Level Neutral-Point-Clamped Inverter Achieving Stress Redistribution Under Moderate Modulation Index

国际期刊
K. Ma, F. Blaabjerg
IEEE Trans. on Power Electronics, Vol. 31, No. 1, pp. 5-10, 2016.
Publication year: 2016

Lifetime Estimation of MMC for Offshore Wind Power HVDC Application

国际期刊
H. Liu, K. Ma, Z. Qin, P. C. Loh, F. Blaabjerg
Journal of Emerging and Selected Topics in Power Electronics, Vol. 4, No. 2, pp. 504-511, 2016.
Publication year: 2016

Frequency-Domain Thermal Modeling and Characterization of Power Semiconductor Devices

国际期刊
K. Ma, N. He, M. Liserre, F. Blaabjerg
IEEE Trans. on Power Electronics, Vol. 31, No. 10, pp. 7183-7193, 2016.
Publication year: 2016

A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations

国际期刊
R. Wu, H. Wang, K. B. Pederson, K. Ma, P. Ghimire, F. Iannuzzo, F. Blaabjerg
IEEE Trans. on Industry Applications, Vol. 52, No. 4, pp. 3306-3314, 2016.
Publication year: 2016
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